nanoFIS 2020 - TOPICS

nanoFIS 2020 - Main Topics

Sophisticated components and devices based on Key Enabling Technologies will enable future high-performance products that integrate more functionalities into a single powerful multifunctional system –a Smart System! Smart Systems will combine an unprecedented variety of components and devices employing nanotechnology, micro- and nanoelectronics and advanced materials as well as photonic, magnetic, or (bio)chemical principles. There is no doubt that Smart Systems will be core enablers and differentiators for the development of many innovative products and services in all sectors of the economy.

The nanoFIS 2020 digital conference is focusing on essential capabilities required for the development of Future Smart Systems:

including materials such as

  • Nanowires, Carbon Nanotubes, Nanorods, Quantum Dots & Nanoparticles
  • 2D-Materials (Graphene, MoS2, MnS2, WS2,…)
  • Nanomaterials Fabrication Technologies (Nanoparticle Synthesis,…)
  • Bio/Bioinspired and Organic Nanomaterials
  • Electroceramic and Metal Oxide Materials
  • Novel Transducer and Flexible Electronic Materials
  • Photonic and Photovoltaic Materials
  • New Thermal Interface Materials
  • New Materials for Sensing

including devices and systems such as

  • Nanoelectronic Devices
  • Nanosensors for Chemical and Biomedical Applications
  • Magnetic Nanodevices, Flexible and Stretchable Devices
  • Micro-, & Nanofluidic Devices
  • 1D- and 2D-Material based Devices
  • (Piezoelectric) Nanoactuators-, resonators & Nanogenerator
  • Energy Harvesters & Storage Devices (microbatteries, supercaps,…)
  • Photonic Devices, Optical Sensors, Quantum Sensors,
  • Single-photon Devices, Nanoemitters, nanoLEDS, -lasers
  • Nanostructured Photovoltaic Devices
  • M(O)EMS & N(O)EMS Devices
  • Ultra-low power nanodevices
  • Nanosystems for IoT applications

including methods and technologies such as

  • Nanoanalytical Methods and Quantum Metrology
  • Accelerated Materials Discovery
  • Advanced Modelling Techniques for Smart Systems
  • MEMS & NEMS Reliability Issues
  • Artificial Intelligence Methods for Failure Detection
  • Modelling and Simulation of Heterogeneous Systems
  • Reliability Issues of Nanomaterials, Nanodevices and Nanosystems

including processes such as

  • Heterogeneous 3D Integration of Sensors, Actuators, Electronics, Communication etc.
  • 3D-Integration Technologies (TSV, SoC, SiP,…)
  • 2D- and 3D Printing Technologies for Heterogeneous System Integration and Papid Manufacturing
  • New Patterning Approaches (Laser Direct Writing, Roll-to-Roll…)
  • Advanced Thin Film Technology (ALD, PLD, Transfer Printing, Ink-Jetting,…)
  • Back-end Equipment for 3D-Integration & Packaging
  • Process Technology for Functional Integration of novel Materials (Graphene,…)
  • Heterogeneous Integration of new Materials
  • Advanced Wafer Bonding Technologies (W2W, D2W,…)
  • Novel More than Moore tools.