nanoFIS 2017 - Main Topics

nanoFIS 2017 - Main Topics

Sophisticated sensors and devices based on Key Enabling Technologies ranging from nanotechnology, micro- and nanoelectronics to photonics, are presently being developed in many R&D labs worldwide for future high-performance products. 3D heterogeneous integration with CMOS-technology is the key for product implementation of those devices and for realizing complex integrated systems with significantly advanced functionalities. This integrated system approach is an essential element of the More-than-Moore Grand Challenge and is expected to create future business opportunities for European semiconductor industries.

ADVANCED FUNCTIONAL MATERIALS
including materials such as

  • Nanowires, Carbon Nanotubes, Nanorods, Quantum Dots & Nanoparticles
  • 2D-Materials (Graphene, MoS2, MnS2, WS2,…)
  • Electroceramic and Metal Oxide Materials
  • Organic and flexible Electronic Materials
  • Photonic Materials

NANODEVICES & NANOSYSTEMS
including devices and systems such as

  • Nanowires, Carbon Nanotubes and Nanoparticles based Devices
  • Nanosensors and Quantum Sensors
  • 2D-Material based Devices
  • Chemical and Particle Nanosensors
  • Nanoresonators & Nanogenerators
  • Nano Energy Harvesting & Energy Storage
  • Nanophotonic Devices
  • MEMS & NEMS Devices
  • Nanodevice Architecture & Design

SYSTEM INTEGRATION & PACKAGING
including technologies such as

  • Heterogeneous Integration
  • TSV Technologies and TVS based Devices
  • 3D-Integration, 3D SoC and SiP Solutions
  • Advanced Wafer Bonding Technologies (W2W, D2W,…)
  • High Performance Integration

NANOANALYTICS & RELIABILITY
including

  • Reliability Issues of Nanomaterials, Nanodevices and Nanosystems
  • Nanoanalytical Methods and Quantum Metrology
  • Material Properties Characterization in nm- and µm-Scale
  • Advanced Material Modelling and Simulation
  • Statistical Models for short, mid and long term Reliability Prediction
  • MEMS & NEMS Reliability Issues

SMART MANUFACTURING PROCESSES
including processes such as

  • Nanomaterials Fabrication Technologies (Synthesis of Quantum Dots, Thermal Oxidation,…)
  • New Patterning Approaches (NIL, roll-to-roll…)
  • Thin Film Deposition (ALD, Spray Pyrolysis, Ink-Jetting, Print Transfer,…)
  • (Post-)Processing of Nanomaterials on CMOS devices
  • Back-end Equipment for 3D-Integration & Packaging
NanoFIS