Key Note Speakers

Jo De Boeck, Executive Vice President & CTO, imec (Belgium)

Mark Brongersma, Stanford University, CA (USA)

Ulrike Diebold, TU Wien, Vienna (Austria)

Liwei Lin, University of California at Berkeley, Mechanical Engineering, Berkeley Sensor and Actuator Center (USA)

Chul-Hong Kim, LG Display. Co., Ltd., HQ, Global Open Innovation Department (Republik of Korea)

Jong Min Kim, University of Cambridge, Department of Engineering (United Kingdom)

Pascale Maury, ASML (The Netherlands)

Mervi Paulasto-Kröckel, Aalto University, Electronics Integration and Reliability,  Aalto (Finland)

Juan Daniel Prades, University of Barcelona, Departament d’Enginyeries: Electrònica, Barcelona (Spain)

Bernd Römer, Infineon Technology AG, Packaging and System Assemby,Regensburg (Germany)

Max Shulaker, MIT – Massachusetts Institute of Technology, Cambridge, MA (USA)

Lars Samuelson, Lund University, Solid State Physics and the Nanometer Structure Consortium (Sweden)

Zhong Lin Wang, Georgia Institute of Technology, Director of Center for Nanostructure Characterization (USA)

Val Zwiller, KTH Royal Institute of Technology Stockholm - Quantum Nano Photonics,TU Delft (Sweden)

Invited Speakers

Tetsuya Baba, National Institute of Advanced Industrial Science and Technology, Tsukuba (Japan)

Francis Balestra, Director of research CNRS, IMEP-LAHC / Grenoble INP-CNRS-UGA (France)

SeungNam Cha, University of Oxford, Department of Engineering Science, Oxford (United Kingdom)

Jun Chen, University of California, Department of Bioengineering, Los Angeles (USA)

Silke Christiansen, Max Planck Institute for the Science of Light,Photonic Nanostructures, Erlangen (Germany)

Elisabetta Comini, University of Brescia, Department of Information Engineering, Sensor Laboratory, Brescia (Italy)

Charl F.J. Faul, University of Bristol, Inorganic and Materials Chemistry, School of Chemistry, Bristol (United Kingdom)

Elvira Fortunato, Universidade NOVA de Lisboa, Materials Science Department,  CENIMAT, Caparica (Portugal)

Christofer Hierold, ETH Zürich, Mechanical and Process Engineering, Micro- and Nanosystems (Switzerland)

Zhiyu (Jerry) Hu, Shanghai Jiao Tong University, National Key Laboratory of Science and Technology (China)

Ho Won Jang, Seoul National University, Department of Materials Science and Engineering (Republic of Korea)

Ki-Bum Kim, Seoul National University, Department of Materials Science and Engineering (Republik of Korea)

Tobias Kraus, INM Leibniz Institute for New Materials, Department of Structure Formation, INM, Saarbrücken (Germany)

Joachim Krenn, Karl-Franzens-University Graz, Nano-Optics Department (Austria)

Johan Liu, Chalmers University of Technology, Department of Microtechnology and Nanoscience (MC2), Electronics Materials and Systems Laboratory, Shanghai University, Göteborg (Sweden)

Thomas Müller,  Vienna University of Technology,  Institute of Photonics (Austria)

Eric Ollier, CEA-Leti, Département de Microtechnologies, Grenoble (France)

Ursula Palfinger, JOANNEUM RESEARCH Forschungs GmbH, Surface Technologies and Photonics, Weiz (Austria)

Klaus Pressel, Infineon Technologies AG, Regensburg (Germany)

Ionut Rado, SOITEC - R&D, Bernin (France)

Albert Romano-Rodriguez, Universitat de Barcelona, MIND-IN2UB-Departament d’Electrònica, Barcelona (Spain)

Kengo Shimanoe, Kyushu University, Faculty of Engineering Sciences, Energy and Material Sciences, Fukuoka (Japan)

Martin Schrems, ams AG, R&D (PDI), Graz (Austria)

Stephan Steinhauer, KTH Royal Institute of Technology, Department of Applied Physics, Quantum Nano Photonics, Stockholm (Sweden)

Gottfried Strasser, Vienna University of Technology, Center for Micro- and Nanostructures (ZMNS), (Austria)

Andreas Waag, TU Braunschweig, Institute of Semiconductor Technology, Laboratory of Emerging Nanometrology LENA, Braunschweig (Germany)

James Watkins, University of Massachusetts Amherst,  Center for Hierarchical Manufacturing, Amherst (USA)

Josef Weber, Fraunhofer - EMFT, Devices and 3D Integration (Germany)

Wei-Yen Woon, National Central University, Department of Physics, Taoyuan City (Taiwan)

Daniel Nilsen Wright, SINTEF Digital, Smart Sensor Systems, Oslo (Norway)

Luca Zanotti, STMicroelectronics SRL, MEMS Technology & Packaging Development, Monza (Italy)

Liu Zheng, Nanyang Technological University, School of Materials Science & Engineering (Singapore)