Key Note Speakers

Liwei Lin, University of California at Berkeley, Mechanical Engineering, Berkeley Sensor and Actuator Center (USA)

Jong Min Kim, University of Cambridge, Department of Engineering, Electrical Engineering (United Kingdom)

Mervi Paulasto-Kröckel, Aalto University, Electronics Integration and Reliability,  Aalto (Finland)

Pascale Maury, ASML (The Netherlands)

Juan Daniel Prades, University of Barcelona, Departament d’Enginyeries: Electrònica, Barcelona (Spain)

Bernd Römer, Infineon Technology AG, Packaging and System Assemby,Regensburg (Germany)

Lars Samuelson, Lund University, Solid State Physics and the Nanometer Structure Consortium (Sweden)

Zhong Lin Wang, Georgia Institute of Technology, Director of Center for Nanostructure Characterization, The Hightower Chair in Materials Science and Engineering, Atlanta (USA)

Invited Speakers

SeungNam Cha, University of Oxford, Department of Engineering Science, Oxford (United Kingdom)

Silke Christiansen, Max Planck Institute for the Science of Light,Photonic Nanostructures, Erlangen (Germany)

Elisabetta Comini, University of Brescia, Department of Information Engineering,Sensor Laboratory, Brescia (Italy)

Ho Won Jang, Seoul National University, Department of Materials Science and Engineering (Republic of Korea)

Joachim Krenn, Karl-Franzens-University Graz, Nano-Optics Department, Graz (Austria)

Thomas Müller,  Vienna University of Technology,  Institute of Photonics, Vienna (Austria)

Eric Ollier, CEA-Leti, Département de Microtechnologies, Grenoble (France)

Ursula Palfinger, JOANNEUM RESEARCH Forschungsgesellschaft mbH, Institute for Surface Technologies and Photonics, Weiz (Austria)

Klaus Pressel, Infineon Technologies AG, Regensburg (Germany)

Ionut Rado, SOITEC - R&D, Bernin (France)

Albert Romano-Rodriguez, Universitat de Barcelona, MIND-IN2UB-Departament d’Electrònica, Barcelona (Spain)

Kengo Shimanoe, Kyushu University, Faculty of Engineering Sciences, Department of Energy and Material Sciences,Fukuoka (Japan)

Martin Schrems, ams AG, R&D (PDI), Graz (Austria)

James Watkins, University of Massachusetts Amherst, Department of Polymer Science and Engineering, Center for Hierarchical Manufacturing, Amherst (USA)

Luca Zanotti
STMicroelectronics SRL, MEMS Technology & Packaging Development, Analog, MEMS and Sensors Product Group, Monza B.za (Italy)

Liu Zheng, Nanyang Technological University, School of Materials Science & Engineering (Singapore)

NanoFIS