Organising Committee

Organising Chair:
Margit Malatschnig, Techkonnex – High-Tech Promotion, Vienna (Austria)

Scientific Chairs:
Anton Köck, MCL - Materials Center Leoben Forschung GmbH, Leoben (Austria)
Joachim Krenn, Karl Franzens University Graz, Nano-Optics Group, Graz (Austria)
Marco Deluca, MCL - Materials Center Leoben Forschung GmbH, Leoben (Austria)

Scientific Advisory Committee

(in alphabetical order)
Nicolae Barsan, University of Tübingen, Institute of Physical and Theoretical Chemistry, Tübingen (Germany)
Istvan Barsony, MTA EK MFA Hungary, Budapest (Hungary)
Jürgen Brugger, EPFL, Microsystems Laboratory, Lausanne (Switzerland)
SeungNam Cha, SKKU Advenced Institut of Nano Technology,  Nanotechnology & Science, Seoul (Korea)
Stephen Y. Chou, Princeton University, Department of Electrical Engineering, Princeton NJ (USA)
Silke Christiansen, Max Planck Institute for the Science of Light,  Photonic Nanostructures, Erlangen (Germany)
Marina Cole, University of Warwick, Smart Sensors and Devices Research Group, Warwick (United Kingdom)
Elisabetta Comini, University of Brescia, Department of Information Engineering, Sensor Lab , Brescia (Italy)
Emmanuel Defay, Luxembourg Institute of Science and Technology (LIST), Science and Analysis of Materials (Luxembourg)
Peter Fürjes, Hungarian Academy of Sciences, Centre for Energy Research, Budapest (Hungary)
Mart Graef, Delft University of Technology, Faculty of Electrical Engineering, Delft (The Netherlands)
Vincenzo Guidi, University of Ferrara, Department of Physics and Earth Sciences, Ferrara (Italy)
Hossam Haick, Technion - Israel Institute of Technology, Nanotechnology Institute, Haifa (Israel)
Rainer Hainberger, Austrian Institute of Technology, Health & Bioresources, Vienna (Austria)
Paul Hartmann, Joanneum Research Forschungs GmbH, Materials Research, Weiz (Austria)
Noriyuki Hasuike, Kyoto Institute of Technology, Department of Electronics, Kyoto (Japan)
Christofer Hierold,
ETH Zürich, Department of Mechanical and Process Engineering  (Switzerland)
Ivan Hotovy, Slovak University of Technology, Institute of Electronics and Photonics, Bratislava (Slovakia)
Zhiyu (Jerry) Hu, Shanghai Jiao Tong University, Institute NanoMicroEnergy (China)
Bernhard Jakoby,
Johannes Kepler University Linz, ARGE Sensorik Austria, Linz (Austria)
Grzegorz Janczyk, ITE Warsaw, Department of Integrated Circuits and Systems Design, Warsaw (Poland)
Ho Won Jang, Seoul National University,Department of Materials Science and Engineering,  Seoul (South Korea)
Jong Min Kim,
University of Cambridge, Department of Engineering, Cambridge (United Kingdom)
Ki-Bum Kim, Seoul National University, Department of Materials Science and Engineering (Republik of Korea)
Martin Kraft, Silicon Austria Labs (SAL), Photonic Systems, Villach (Austria)
Jong-Heun Lee, Korea University, Department of Materials Science and Engineering, Seoul (Korea)
Ying-Chih Liao, National Taiwan University, Chemical Engineering, Taipei (Taiwan)
Charles M. Lieber, Harvard Universtiy, Department of Chemistry & Chemical Biology, Cambridge MA (USA)
Peter Lieberzeit, University of Vienna, Department of Physical Chemistry, Vienna (Austria)
Barbara Malic, Institut Jozef Stefan, Electronic Ceramics Department, Ljubljana (Slovenia)
Torsten Mayr, Graz University of Technology, Institute of Analytical Chemistry and Food Chemistry, Graz (Austria)
Arben Merkoci, Institut Català de Nanociencia i Nanotecnologia, Nanobioelectronics & Biosensors (Spain)
Christian Mitterer,
Montanuniversität Leoben, Physical Metallurgy and Materials Testing, Leoben (Austria)
Paul Muralt, EPFL, Institute of Materials Science and Engineering, Lausanne (France)
Inkyu Park, KAIST Korea Advanced Institute of Science and Technology, Daejeon (Korea)
Mervi Paulasto-Kröckel, Aalto University, Electronics Integration and Reliability, Aalto (Finland)
Daniel Prades, University of Barcelona, Department of Engineering, Barcelona (Spain)
Donatella Puglisi, Linköping University, Department of Physics, Chemistry and Biology, Linköping (Sweden)
Peter Ramm, Fraunhofer EMFT, Strategic Projects, Munich (Germany)
Pavel Ripka, Czech Technical University, Faculty of Electrical Engineering, Prag (Czech Republic)
Kengo Shimanoe, Kyushu University, Engineering Sciences, Energy and Material Sciences, Fukuoka (Japan)
Pietro Siciliano, Italian National Research Council, Institute for Microelectronics and Microsystems, Lecce (Italy)
Mukhles Sowwan, Okinawa Institute of Science and Technology, Nanoparticles by Design, Onna (Japan)
Gottfried Strasser, Vienna University of Technology, Institute of Solid State Electronics, Vienna (Austria)
Susan E. Trolier-Mckinstry, Penn State University, Smart Materials Integration Laboratory, Nanofab, PA (USA)
Florin Udrea, Cambridge University, Department of Engineering, Cambridge (United Kingdom)

Alexey Vasiliev, National Research Center „Kurchatov Institute“, Chemical and Physical Technology, Moscow (Russia)

Jean Paul Viricelle,
Ecole des Mines de St-Etienne (France)

Sten Vollebregt,
TU Delft, Electronic Components, Technology and Materials, Delft (Sweden)

Zhong Lin Wang,
Georgia Institute of Technology, Engineering Department of Materials, Atlanta (USA)

Val Zwiller,
KTH Royal Institute of Technology Stockholm - Quantum Nano Photonics,TU Delft (Sweden)

 

Industrial Advisory Committee

(in alphabetical order)
Christoph Auer, EPCOS OHG - A Member of TDK-EPC Corporation, Deutschlandsberg (Austria)
Livio Baldi, Micron Semiconductors Italia, Director, Technology R&D, Agrate Brianza (Italy)
Klaus Bernhardt, FEEI – the Association of the Austrian Electrical and Electronics Industries, Vienna (Austria)
Patrick Blouet, STMicroelectronics, Grenoble (France)
Frank Boschman, Boschman Technologies B.V., Duiven (The Netherlands)
Sywert Brongersma, Holst Centre/imec, Eindhoven (The Netherlands)
Simon Deleonibus, CEA, LETI, Research Director, MINATEC Campus, Grenoble (France)
Anna Della Porta, saes group, Milano (Italy)
Maximilian Fleischer, Siemens AG, Corporate Technology, Munich (Germany)
Michael Heuken, AIXTRON SE, Corporate Research and Development, Herzogenrath (Germany)
Didier Landru, SOITEC, Semicontuctor Materials, Bernin (France)
Andy Miller, imec, 3D Enabled System Integration, Antwerp Area (Belgium)
Jan Niehaus, Fraunhofer Institute for Applied Polymer Research IAP, Hamburg (Germany)
Stefan Raible, ams AG, Business Line Environmental Sensors, Reutlingen (Germany)
Michael Salter, Acreo Swedish ICT AB, Nanoelectronics Department, Kista (Sweden)
Martin Schrems, AT&S AG, Director Strategy and Business Development, Leoben (Austria)
Wolfgang Timmelthaler, E + E Elektronik Ges.m.b.H., Engerwitzdorf (Austria)
Ewald Wachmann, ams AG, R&D, Premstätten (Austria)

Markus Wimplinger,
EV Group, Corporate Technology Development, St. Florian (Austria)

Jui-Lin (Ray) Yang, ITRI Industrial Technology Research Institute, Hsinchu (Taiwan)
Christian Zenz, NXP Austria GmbH, Packaging & Assembly, Gratkorn (Austria)

 

 

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